Latest news
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DEGSON Becomes China's First Terminal Manufacturer to Achieve VDE-TDAP Stage 3 Certification
On January 12, 2026, DEGSON and VDE Testing and Certification Institute (VDE) jointly held the VDE-TDAP Stage 3 Certificate Awarding Ceremony and "VDE Strategic Partner" Plaque Presentation in Ningbo, China.
Press release
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DEGSON JB Series Junction Boxes: Application Scenarios & Solutions for the Semiconductor Industry
IP67 high-protection junction boxes have become a key supporting product to address industry pain points.
2026-06-24 15:54
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DEGSON DF20 Series Remote I/O Modules for Printing Industry
DEGSON DF20 series remote I/O modules feature multi-protocol compatibility, distributed deployment, high-speed stable transmission and strong anti-interference performance.
2026-06-24 15:28
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DEGSON Becomes China's First Terminal Manufacturer to Achieve VDE-TDAP Stage 3 Certification
On January 12, 2026, DEGSON and VDE Testing and Certification Institute (VDE) jointly held the VDE-TDAP Stage 3 Certificate Awarding Ceremony and "VDE Strategic Partner" Plaque Presentation in Ningbo, China.
2026-06-24 13:33
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Efficient Wiring and Reliable Connection丨DEGSON DG266-3.5/5.0 Series PUSH-IN PCB Terminal Block
DEGSON swiftly responds to market demands by developing front-wired PUSH-IN PCB terminal block.
2024-12-18 09:23
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DG271 Series Connect to the future
The power source of the new energy industry
2024-12-16 09:45
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DG212 Series Upgrade
Energize the Future of Intelligent Manufacturing
2024-12-12 09:48
